Flip chip, also well-known as controlled collapse chip connection (C4), comprises of conductive bumps deposited on chip pads on the surface of wafer, followed by increasing semiconductor devices by flipping the chip. The implementation of flip chip has augmented in the electronic industry owing to its several benefits such as lower cost, high packaging density, enhanced reliability of circuits, and compact dimensions. Thus, increase in requirement for smart electronics across the globe is a foremost factor projected to propel the growth of the global flip chip market size during the review period.
Furthermore, flip chip has revolutionized the movable electronics and electric vehicle industries by showing to be an ideal product for the electrical interconnections.
According to the report analysis, ‘Global Flip Chip Substrate Market Report 2020 by Key Players, Types, Applications, Countries, Market Size, Forecast to 2026 (Based on 2020 COVID-19 Worldwide Spread)’ states that NANDIAN, Shinko, Xilinx, Toppan Printing Co., Ltd., Texas Instruments, Amkor, Nan Ya PCB Corporation, IBIDEN CO.,LTD., Faraday Technology Corporation, ASE Group, TTM Technologies, Inc., Ibiden, CHUAN MO, Unimicron and many more are the key companies which presently working in the global flip chip substrate market more actively for keep maintaining the governing position, leading the highest market growth, generating the highest percentage of revenue, obtaining the competitive edge and registering the great value of market share by analysing the strategies and policies of government as well as contenders, increasing the features and benefits of flip chip, spreading the awareness connected to the applications and advantages flip chip, implementing the policies of profit making and strategies of expansion, improving the qualitative and quantitative measures of such, establishing the several research and development programs and decreasing the associated prices of such.
The effective growth in trend of real-world gaming is projected to influence the growth of the global flip chip market, as they are incorporated in the processors utilized inside gaming consoles and graphic cards utilized in personal computers. Foremost players such as AMD and Intel are spending considerable amount on intensive research and development for the enhancement of these chips. Furthermore, flip chips are incorporated in sensors utilized in smartphones, which deliver the users a real-life experience while playing games, as they change visuals according to the motion of phone. Surge in requirement for these sensors and processors is projected to boost the flip chip market growth during the forecast duration.
One major benefit that flip chip offers over other technologies is its ability to deliver the data transmission between devices on higher frequency. This is accredited to the fact that connections are made through bumps in flip chips, which decrease the length and in turn offer enhanced electrical efficiency. Surge in requirement for high-frequency microwave, ultrasonic frequency operations and growth in requirement for high-speed portable devices are expected to underwrite toward the growth of the global flip chip market during the near future.
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Ankur Gupta, Head Marketing & Communications